芯片贴片键合设备
微组装流水线中适用的各方面贴片设施键合设施,推拉力公测设施等,是半导产(chan)出线上(shang)完之后封口步(bu)骤必会的关键的机(ji)器。包括软(ruan)件(jian)(jian)(jian)于混(hun)和(he)控(kong)制(zhi)电(dian)路、COB控(kong)制(zhi)摸块;MCM、MEMS电(dian)子(zi)(zi)元(yuan)元(yuan)电(dian)子(zi)(zi)元(yuan)件(jian)(jian)(jian)封装(zhuang);RF电(dian)子(zi)(zi)元(yuan)元(yuan)电(dian)子(zi)(zi)元(yuan)件(jian)(jian)(jian)封装(zhuang)/控(kong)制(zhi)摸块;光(guang)电(dian)材料(liao)电(dian)子(zi)(zi)元(yuan)元(yuan)电(dian)子(zi)(♋zi)元(yuan)件(jian)(jian)(jian)封装(zhuang)、雷达探(tan)测电(dian)子(zi)(zi)元(yuan)元(yuan)电(dian)子(zi)(zi)元(yuan)件(jian)(jian)(jian)封装(zhuang)等电(dian)子(zi)(zi)元(yuan)元(yuan)电(dian)子(zi)(zi)元(yuan)件(jian)(jian)(jian)封装(zhuang)产量。